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EIA JESD 51-7:1999
New product
EIA JESD 51-7:1999
High Effective Thermal Conductivity Test Board for Leaded Surface Mount PackagesMore info
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. The objective of the standard is to provide a high effective thermal conductivity mounting surface that can be compared equally against standard tests done in different laboratories with typical variations of less than or equal to 10%.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| ICS | 31.020 : Electronic components in general
|
| Number of pages | 13 |
| Year | 1990 |
| Document history | |
| Country | USA |
| Keyword | EIA JESD 51;EIA 51;EIA 51.7;51;EIA JESD51-7 |