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EIA JESD 51-5:1999

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EIA JESD 51-5:1999

Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms

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This extension of the thermal standards provides a standard fixture for direct attach type packages such as deep-downset of thermally tabbed packages. This specification provides additional design detail for use in developing thermal test boards with application to these package types. This document is in addition to and not replacement for the design specifications in other standards.

Author EIA
Editor EIA
Document type Standard
Format File
ICS 31.080.01 : Semiconductor devices in general
Number of pages 9
Year 1990
Document history
Country USA
Keyword EIA JESD 51;EIA 51;EIA 51.5;51;EIA JESD51-5