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This test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compound voids, etc.) nondestructively in plastic packages while achieving reproducibility.
Author | EIA |
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Editor | EIA |
Document type | Standard |
Format | File |
Confirmation date | 2010-09-01 |
ICS | 31.020 : Electronic components in general
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Number of pages | 18 |
Cross references | IPC JEDEC-J-STD-035 (1999-04-01), IDT |
Year | 1990 |
Document history | |
Country | USA |
Keyword | EIA 035;035 |