EIA JEP 114.01:2007 (R2013)

This publication is intended only as a guideline to test facilities in their efforts to establish and maintain consistent PIND testing. Imposition of these suggestions, or any part thereof, is within the province of each test facility as to its respective needs. SECTION I reviews specific PIND requirements on electronic devices and manufacturer facilities to satisfy customer needs and military specifications. SECTION II discusses representative sources of particles that may be generated during device manufacturing. However, it should be noted that the nature, type and sources of particles can vary widely in different manufacturing facilities with different technologies, materials and processes and in no way is limited to those mentioned here. (12, 13) SECTION III covers most aspects of the PIND system including test principles, calibration and maintenance, device attachment mediums and sources of interference and prevention methods. SECTION IV covers operator education, training and certification. It is a guide to users for elimination of false particle detection due to improper testing by operators. SECTION V covers the methods of loose particle recovery and failure analysis of PIND failures. The section includes process control measures for PIND testing and references made to product quality verification is included. With measurement consistency and reliable PIND results achievable and in control, manufacturers will be able to focus on the root causes of particles in the products and processes and will be able to eliminate the defects to enhance the device quality. SECTION VI covers a brief summary of this publication. JEDEC acknowledges that these publication materials are derived from information from the list of references, from participant companies' internal documents and discussions from PIND Task Group meetings of the JEDEC JC-13 (Government Liaison) and JC-13.5 (Government Liaison - Hybrid Microcircuit Technology) Committees.