Cart
0
Product
Products
(empty)
No products
To be determined
Shipping
$0.00
Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart.
There is 1 item in your cart.
Total products
Total shipping
To be determined
Total
Reduced price!
View larger
View larger
EIA-364-71C:2008
New product
EIA-364-71C:2008
TP-71C SOLDER WICKING (WAVE SOLDER TECHNIQUE) TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETSMore info
This standard applies to connectors and sockets that are mounted to printed wiring boards (PWB) employing through mount technology. Object The purpose of this test is to determine whether a specimen can be wave soldered to a printed wiring board without sustaining damage caused by solder wicking onto the contact surfaces or other areas that might alter its operating characteristics.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| ICS | 29.120.20 : Connecting devices
|
| Number of pages | 16 |
| Replace | EIA-364-71B (2001-01) |
| Cross references | ANSI/EIA-364-71C (2008), IDT |
| Year | 2008 |
| Document history | EIA-364-71C (2008-05) |
| Country | USA |
| Keyword | EIA 364;EIA 364.71C;EIA-364;364 |