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The document relates to resin based reactive compounds and their components used for electrical insulation. All reactive compounds are solvent-free and may contain reactive diluents and fillers. The reaction involved in curing are polymerization and/or crosslinking. It does not relate to reactive compounds used as coating powders.
| Author | VDE |
|---|---|
| Editor | VDE |
| Document type | Standard |
| Format | Paper |
| ICS | 01.040.29 : Electrical engineering (Vocabularies)
29.035.20 : Plastics and rubber insulating materials |
| Number of pages | 10 |
| Replace | DIN 46448-1 (1969-01) |
| Cross references | EN 60455-1 (1998-10), IDT |
| Weight(kg.) | 0.1170 |
| Year | 1990 |
| Document history | DIN EN 60455-1 (1999-06) |
| Country | Germany |
| Keyword | DIN EN 60455;EN 60455;EN 60455-1;60455 |