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This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.
| Author | VDE | 
|---|---|
| Editor | VDE | 
| Document type | Standard | 
| Format | Paper | 
| ICS | 19.040 : Environmental testing 31.190 : Electronic component assemblies | 
| Number of pages | 59 | 
| Replace | DIN EN 60068-2-54 (2007-01) | 
| Cross references | EN 60068-2-69 (2017-06), IDT | 
| Modified by | DIN EN 60068-2-69 Berichtigung 1 (2018-05) | 
| Weight(kg.) | 0.2003 | 
| Year | 2018 | 
| Document history | DIN EN 60068-2-69 (2018-01) | 
| Country | Germany | 
| Keyword | DIN EN 60068;DIN EN 60068-2;EN 60068;EN 60068-2;EN 60068-2-69;60068 |