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JIS C 6472:1995 (R2014)
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JIS C 6472:1995 (R2014)
Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)More info
This Japanese Industrial Standard specifies the copper-clad laminates to be used for flexible printed wiring boards (employing, polyester film or polyimide film as the base) (hereafter referred to as 'copper-clad laminates').
| Author | JSA |
|---|---|
| Editor | JSA |
| Document type | Standard |
| Format | File |
| Confirmation date | 2014-10-20 |
| ICS | 13.220.40 : Ignitability and burning behaviour of materials and products
31.180 : Printed circuits and boards |
| Number of pages | 10 |
| Cross references | IEC 60249-2-8 (1987), NEQ |
| Year | 1990 |
| Document history | |
| Country | Japan |
| Keyword | JIS 6472;6472;JIS C 6472-1995 |