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This Japanese Industrial Standard specifies test methods of copper-clad laminates for printed wiring boards (hereafter referred to as 'copper-clad laminates').
Author | JSA |
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Editor | JSA |
Document type | Standard |
Format | File |
Confirmation date | 2015-10-20 |
ICS | 31.180 : Printed circuits and boards
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Number of pages | 40 |
Cross references | IEC 60249-1 (1982), MOD |
Year | 1990 |
Document history | |
Country | Japan |
Keyword | JIS 6481;6481;JIS C 6481-1996 |