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JIS C 61191-6:2011 (R2016)

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JIS C 61191-6:2011 (R2016)

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

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Author JSA
Editor JSA
Document type Standard
Format File
Confirmation date 2016-10-20
ICS 31.180 : Printed circuits and boards
Number of pages 34
Cross references IEC 61191-6 (2010-01), IDT
Year 2011
Document history
Country Japan
Keyword JIS C 61191;JIS 61191;61191