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JIS Z 3284-4:2014
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JIS Z 3284-4:2014
Solder paste - Part 4: Test methods for wettability, solderball and spreadMore info
This Standard specifies the flux efficacy and de-wetting test, solderball test, spread test, wetting balance test and displacement detection wetting test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
| Author | JSA |
|---|---|
| Editor | JSA |
| Document type | Standard |
| Format | File |
| ICS | 31.180 : Printed circuits and boards
|
| Number of pages | 28 |
| Replace | JIS Z 3284 (1994-03-01) |
| Cross references | IEC 61189-5 (2006-08), MOD
|
| Year | 2014 |
| Document history | JIS Z 3284-4 (2014-06-20) |
| Country | Japan |
| Keyword | JIS Z 3284;JIS 3284;3284 |