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JIS Z 3284-2:2014
New product
JIS Z 3284-2:2014
Solder paste - Part 2: Test methods for solder particle shape, surface condition judgment, and particle size distributionMore info
This Standard specifies the shape, surface condition judgment test and particle size distribution measurement test of the solder particles of solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
| Author | JSA |
|---|---|
| Editor | JSA |
| Document type | Standard |
| Format | File |
| ICS | 31.180 : Printed circuits and boards
|
| Number of pages | 14 |
| Replace | JIS Z 3284 (1994-03-01) |
| Cross references | IEC 61189-6 (2006-07), MOD
|
| Year | 2014 |
| Document history | JIS Z 3284-2 (2014-06-20) |
| Country | Japan |
| Keyword | JIS Z 3284;JIS 3284;3284 |