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JIS C 5630-13:2014
New product
JIS C 5630-13:2014
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structuresMore info
| Author | JSA |
|---|---|
| Editor | JSA |
| Document type | Standard |
| Format | File |
| ICS | 31.080.01 : Semiconductor devices in general
31.220.01 : Electromechanical components in general |
| Number of pages | 12 |
| Cross references | IEC 62047-13 (2012-02), IDT
|
| Year | 2014 |
| Document history | |
| Country | Japan |
| Keyword | JIS C 5630;JIS 5630;5630 |