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JIS C 62137-4:2016

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JIS C 62137-4:2016

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

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Author JSA
Editor JSA
Document type Standard
Format File
ICS 31.020 : Electronic components in general
31.190 : Electronic component assemblies
Number of pages 42
Cross references IEC 62137-4 (2014-10), IDT
Year 2016
Document history
Country Japan
Keyword JIS C 62137;JIS 62137;62137