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ASTM F459-13(2018)
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ASTM F459-13(2018)
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire BondsMore info
1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 μm).
Note 1: Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire span.
| Author | ASTM |
|---|---|
| Editor | ASTM |
| Document type | Standard |
| Format | File |
| Confirmation date | 2018-03-01 |
| ICS | 29.120.20 : Connecting devices
|
| Number of pages | 5 |
| Replace | ASTM F459-13 |
| Set | ASTMVOL1004 |
| Year | 2013 |
| Document history | ASTM F459-13 |
| Country | USA |
| Keyword | ASTM 459;ASTM F459;ASTM F459;10.1520/F0459-13R18 |