No products
View larger
New product
1.1 This practice covers nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression or thermosonic techniques. The test is intended to reveal (by breaking) nonacceptable wire bonds but is designed to avoid damage to acceptable wire bonds.
Note 1: Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire span.
| Author | ASTM |
|---|---|
| Editor | ASTM |
| Document type | Standard |
| Format | File |
| Confirmation date | 2018-03-01 |
| ICS | 29.120.20 : Connecting devices
|
| Number of pages | 3 |
| Replace | ASTM F458-13 |
| Set | ASTMVOL1004 |
| Year | 2013 |
| Document history | ASTM F458-13 |
| Country | USA |
| Keyword | ASTM 458;ASTM F458;ASTM F458;10.1520/F0458-13R18 |