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ASTM B774-00(2014)
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ASTM B774-00(2014)
Standard Specification for Low Melting Point AlloysMore info
1.1 This specification covers low-melting point metal alloys and solders, including bismuth-tin, bismuth-lead, bismuth-tin-lead, bismuth-tin-lead-cadmium, bismuth-tin-lead-indium-cadmium, bismuth-tin-lead-indium, indium-lead, and indium-lead-silver, and indium-tin joining together two or more metals at temperatures below their melting points; blocking for support and removable borders; radiation shielding; fusible plugs; fuses; tube bending; and punch setting.
1.1.1 This specification shall include those alloys having a liquidus temperature not exceeding 361°F (183°C), the melting point of the tin lead eutectic.
| Author | ASTM |
|---|---|
| Editor | ASTM |
| Document type | Standard |
| Format | File |
| Confirmation date | 2014-10-01 |
| ICS | 77.120.01 : Non-ferrous metals in general
|
| Number of pages | 4 |
| Replace | ASTM B774-00(2010) |
| Set | ASTMVOL0204 |
| Year | 2005 |
| Document history | ASTM B774-00(2010) |
| Country | USA |
| Keyword | ASTM 774;ASTM B774;ASTM B774;10.1520/B0774-00R14 |