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BS IEC 63011-2:2018
New product
BS IEC 63011-2:2018
Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnectMore info
| Author | BSI |
|---|---|
| Editor | BSI |
| Document type | Standard |
| Format | File |
| EAN ISBN | 978 0 580 97375 8 |
| ICS | 31.200 : Integrated circuits. Microelectronics
|
| Number of pages | 18 |
| Cross references | IEC 63011-2:2018 |
| Year | 2019 |
| Country | United Kingdom |