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IEEE 1301.1
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IEEE 1301.1 91st Edition, June 27, 1991 Standard for Metric Equipment Practice for Microcomputers - Convection-Cooled with 2 mm Connectors
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Description / Abstract:
Foreword
(This Foreword is not a part of IEEE Std 1301.1-1991, IEEE Standard for a Metric Equipment Practice for Microcomputers— Convection-Cooled with 2 mm Connectors.)
This detail standard has been developed in conjunction with IEEE Std 1301-1991 and by the same people.
The Metric Equipment Practice Study Group and Working Group have been active since July of 1989. During this time, the computer industry has shown a remarkable interest in the development of this specification, and the participation by many experts has enabled it to be developed in a very short time. Around 200 people have participated in the creation of this specification. Although it is not possible to acknowledge everyone who contributed, several individuals deserve special mention for the contributions they made toward the development of this document:
Dr. Paul Borrill of Sun Microsystems and Mike Humphrey of BICC-Vero for their support during the initial phases as well as during the whole activity.
Hans-Werner Kranz and Hans-Juergen Richter of Siemens, and Helge Bodahl Johnsen of Ellemtel, for numerous presentations and discussions concerning the importance of metrication.
Ernie Crocker of Digital Equipment Corp. for providing extensive support during the critical phases of the work.
Extensive technical input has been submitted by Charlie Barker, David Moore, and Rick Olson of Digital Equipment Corp., Gene Schramm, Roger Johnson, and Vid Chandraiah of ATT Bell Laboratories, Peter Odell of BICC-Vero, Eike Waltz and Paul Mazura of Schroff, Hans-Werner Kranz and Hans-Juergen Richter of Siemens, David Brearley of DuPont Electronics, Greger Haraldsson, Kristian Martinsson, and Torbjörn Olsson of Ericsson Telecom, Helge Bodahl Johnsen of Ellemtel, Michael Thompson of Mupac, Paul Cook of Ameritech Services, and Joe Macura of Data General.
Extensive support for editing, copying, and mailing has been given by Rick Olson and Charlie Barker of Digital Equipment Corp., Joe Trainor of ITT Electro-Mechanical Components, Paul Cook of Ameritech Services, David Brearley of DuPont Electronics, Peter Odell of BICC-Vero, Rich Carlsson of Harting Elektronik, Richard Goerges and Tom Klinefelter of Dupont Electronics, Doug Fieldhouse of Dupont Imaging Systems, Jean-Jacques Dumont of Souriau, Gene Schramm and Vid Chandraiah of ATT Bell Laboratories, and Kristian Martinsson of Ericsson Telecom.
Scope
This is a detail standard for subracks, plug-in units, printed boards, and backplanes to be used in conjunction with IEEE Std 1301-1991 [16]1 and a 2 mm connector as defined in EIA IS-64 (1991)
(This Foreword is not a part of IEEE Std 1301.1-1991, IEEE Standard for a Metric Equipment Practice for Microcomputers— Convection-Cooled with 2 mm Connectors.)
This detail standard has been developed in conjunction with IEEE Std 1301-1991 and by the same people.
The Metric Equipment Practice Study Group and Working Group have been active since July of 1989. During this time, the computer industry has shown a remarkable interest in the development of this specification, and the participation by many experts has enabled it to be developed in a very short time. Around 200 people have participated in the creation of this specification. Although it is not possible to acknowledge everyone who contributed, several individuals deserve special mention for the contributions they made toward the development of this document:
Dr. Paul Borrill of Sun Microsystems and Mike Humphrey of BICC-Vero for their support during the initial phases as well as during the whole activity.
Hans-Werner Kranz and Hans-Juergen Richter of Siemens, and Helge Bodahl Johnsen of Ellemtel, for numerous presentations and discussions concerning the importance of metrication.
Ernie Crocker of Digital Equipment Corp. for providing extensive support during the critical phases of the work.
Extensive technical input has been submitted by Charlie Barker, David Moore, and Rick Olson of Digital Equipment Corp., Gene Schramm, Roger Johnson, and Vid Chandraiah of ATT Bell Laboratories, Peter Odell of BICC-Vero, Eike Waltz and Paul Mazura of Schroff, Hans-Werner Kranz and Hans-Juergen Richter of Siemens, David Brearley of DuPont Electronics, Greger Haraldsson, Kristian Martinsson, and Torbjörn Olsson of Ericsson Telecom, Helge Bodahl Johnsen of Ellemtel, Michael Thompson of Mupac, Paul Cook of Ameritech Services, and Joe Macura of Data General.
Extensive support for editing, copying, and mailing has been given by Rick Olson and Charlie Barker of Digital Equipment Corp., Joe Trainor of ITT Electro-Mechanical Components, Paul Cook of Ameritech Services, David Brearley of DuPont Electronics, Peter Odell of BICC-Vero, Rich Carlsson of Harting Elektronik, Richard Goerges and Tom Klinefelter of Dupont Electronics, Doug Fieldhouse of Dupont Imaging Systems, Jean-Jacques Dumont of Souriau, Gene Schramm and Vid Chandraiah of ATT Bell Laboratories, and Kristian Martinsson of Ericsson Telecom.
Scope
This is a detail standard for subracks, plug-in units, printed boards, and backplanes to be used in conjunction with IEEE Std 1301-1991 [16]1 and a 2 mm connector as defined in EIA IS-64 (1991)