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Description / Abstract:
This generic standard may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The choice of coordination dimensions for the mechanical structure for heights, widths, and depths lies within a homogeneous, metric, modular, three-dimensional grid as specified in IEC 917 (1988) [13]. Optimum conditions are thereby created for the application of computer-assisted methods throughout design and manufacturing, such as, for instance, computer-assisted planning, development, manufacturing, testing, and installation.