Cart
0
Product
Products
(empty)
No products
To be determined
Shipping
$0.00
Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart.
There is 1 item in your cart.
Total products
Total shipping
To be determined
Total
Reduced price!
View larger
View larger
IEEE 1156.1
New product
IEEE 1156.1 1993 Edition, January 1, 1993 Microcomputer Environmental Specification for Computer Modules
More info
Description / Abstract:
This specification is designed for use in conjunction with other
families of documents such as IEEE Std1101.x, IEEE Standard for
Mechanical Core Specifications for Microcomputers; IEEE Std 896.x,
IEEE Standard Backplane Bus Specification for Multiprocessor
Architectures: Futurebus+; IEEE Std 1596-1992, IEEE Standard for
Scalable Coherent Interface (SCI); IEEE Std 1014-1987, IEEE
Standard for a Versatile Backplane Bus: VMEbus; IEEE Std 1296-1987,
IEEE Standard for a High-Performance Synchronous 32-Bit Bus:
MULTIBUS®2 II; and IEEE Std 1301- 1991, IEEE Standard for a Metric
Equipment Practice for Microcomputers—Coordinating Document.
This standard is intended to be used as a core specification. It contains the minimum environmental withstand conditions that are applicable to computer modules/circuit boards and all of the components attached to those modules. It has been created to provide general environmental withstand conditions for one or more of the previously listed computer buses or interconnect standards. It may also apply to electronic equipment in general.
While this document was specifically created for use with IEEE computer bus standards, nothing herein is intended to restrict its use for other applications, where applicable. A supplier and user may agree to more or less restrictive environmental specifications than those listed in this standard. However, if their specifications are less restrictive than those listed herein, neither supplier nor user may claim conformance to this document.
Purpose
The purpose of this standard is to provide a common set of specifications for physical integrity and environmental performance levels for computer modules and their components.
It is the responsibility of the system designer to evaluate the relationship between this module-level environmental specification and the system-level environmental specification for the enclosure that contains the modules. For example, in some applications, the modules are conduction cooled and a system-level thermal "model" is required to determine the relationship between the module's heat sink and the system-level cooling medium.
This standard is intended to be used as a core specification. It contains the minimum environmental withstand conditions that are applicable to computer modules/circuit boards and all of the components attached to those modules. It has been created to provide general environmental withstand conditions for one or more of the previously listed computer buses or interconnect standards. It may also apply to electronic equipment in general.
While this document was specifically created for use with IEEE computer bus standards, nothing herein is intended to restrict its use for other applications, where applicable. A supplier and user may agree to more or less restrictive environmental specifications than those listed in this standard. However, if their specifications are less restrictive than those listed herein, neither supplier nor user may claim conformance to this document.
Purpose
The purpose of this standard is to provide a common set of specifications for physical integrity and environmental performance levels for computer modules and their components.
It is the responsibility of the system designer to evaluate the relationship between this module-level environmental specification and the system-level environmental specification for the enclosure that contains the modules. For example, in some applications, the modules are conduction cooled and a system-level thermal "model" is required to determine the relationship between the module's heat sink and the system-level cooling medium.