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Reduced price! JEDEC JESD22-B112A

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JEDEC JESD22-B112A

Reference: M00003836

Condition: New product

JEDEC JESD22-B112A PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE

standard by JEDEC Solid State Technology Association, 10/01/2009

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The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount soldering operation.

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Published: 10/01/2009 Number of Pages: 30File Size: 1 file , 1 MB